7 articles tagged with this topic.
IR drop analysis in VLSI explained for physical design engineers: where supply and ground drop come from, static vs dynamic IR drop, vectorless and vector-based analysis, how IR drop affects setup and hold, and how to debug and fix hotspots, with illustrative examples, a flowchart and interview Q&As.
Backside power delivery moves the power grid below the transistors. What it changes in floorplanning, PDN, placement, CTS, routing, IR/EM and thermal signoff, with a practical checklist.
Power We will discuss more about power analysis in ECO section while working on PDN, for now let’s take basic glimpse of the power analysis and consumption. There are basically 2 types of power consumption in VLSI design: 1. Dynamic Power Dissipation 2. Static Power Dissipation 1. Dynamic Power There are two types of dynamic […]
