7 articles tagged with this topic.
The total shipment of semiconductors this year is expected to exceed the 1 trillion mark. This includes transportation of ICs and optoelectronics, sensors/actuators and discrete (O-S-D) devices. According to a report, by 2021, semiconductor shipments will increase by 13%, reaching a record 1.135 trillion units. This is also the third time the semiconductor sector has […]
What are VIAs in VLSI? Types of VIAs Single Cut Via Single cut via is a type of via where we have only one poly connection between the two connecting metal layers. Below picture will explain better. Multi Cut Via A multi cut via is a type of VIA where there is multiple poly connections […]
Pitch The distance between the center to center of the metal is called as pitch. In the below picture, B is pitch. Spacing Spacing is the distance between the edge to edge metal layers. The distance A is spacing in below picture. Offset Offset is the distance between the core and first metal layer. In […]
Power We will discuss more about power analysis in ECO section while working on PDN, for now let’s take basic glimpse of the power analysis and consumption. There are basically 2 types of power consumption in VLSI design: 1. Dynamic Power Dissipation 2. Static Power Dissipation 1. Dynamic Power There are two types of dynamic […]
What is Placement? Once we are done with the floorplan after placing all the physical cells inside the core boundary, we are left with standard cells which are still sitting out of the core design area. Now we need to place all the standard cell sitting outside this core boundary. Placing of these standard cells […]
